High K integration of gate dielectric with integrated spacer formation for high speed CMOS
AssigneeAdvanced Micro Devices, Inc.
InventorsMark I. Gardner, Dim-Lee Kwong, H. Jim Fulford
Life of this patent
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AssigneeAdvanced Micro Devices, Inc.
InventorsMark I. Gardner, Dim-Lee Kwong, H. Jim Fulford
Estimating the term…
An integrated circuit and a method of making a transistor thereof are provided. In one aspect, the method includes the steps of forming a gate insulating layer on the substrate with a first outwardly tapered sidewall and a second outwardly tapered sidewall. A gate electrode is formed on the gate insulating layer. A first source/drain region and a second source/drain region are formed in the substrate by implanting ions into the substrate, wherein a first portion of the ions passes through the first sidewall and a second portion of the ions passes through the second sidewall. The method provides for incorporation of spacer-like structure into a gate dielectric layer. Conventional spacer fabrication may be eliminated and graded source/drain regions established with a single implant.
A transistor on a substrate, comprising:
An integrated circuit, comprising:
A transistor on a substrate, comprising:
Dependencies are inferred from the claim text.