PCB having holes between terminals and method of making the same

A printed circuit board (PCB) for mounting a dielectric radio frequency (RF) band pass filter (BPF) thereon, the filter having an input terminal, an output terminal, and a ground terminal including a first, a second, and a third terminal, the PCB comprising:

• a first terminal for mounting the input terminal of the RF BPF thereon;
• a second terminal for mounting the output terminal of the RF BPF thereon, said second terminal disposed horizontally apart from said first terminal by a predetermined distance;
• a third terminal for mounting the first terminal of the ground terminal of the RF BPF thereon, said third terminal disposed between said first and said second terminals;
• a fourth terminal for mounting the second terminal of the ground terminal of the RF BPF thereon, said fourth terminal disposed vertically apart from said first terminal by a predetermined distance;
• a fifth terminal for mounting the third terminal of the ground terminal of the RF BPF thereon, said fifth terminal disposed vertically apart from said second terminal by a predetermined distance;
• a first hole formed between said first and said third terminals of the PCB in the PCB thickness direction;
• a second hole between said second and said third terminals of the PCB in the PCB thickness direction;
• a third hole between said first and said fourth terminals of the PCB in the PCB thickness direction;
• and
• a fourth hole between said second and said fifth terminals of the PCB in the PCB thickness direction.

A method for making a printed circuit board (PCB) on which a dielectric radio frequency (RF) band pass filter (BPF) is to be mounted, the BPF having an input terminal, an output terminal, and a ground terminal between the input and output terminals, the ground terminal including a first, a second, and a third terminal on the bottom thereof, and second terminal vertically spaced from the input terminal, and the third terminal vertically spaced from the output terminal, the method comprising the steps of:

• forming an input terminal and an output terminal horizontally in-line, for respectively mounting the input and output terminals of the RF BPF thereon;
• forming a first terminal for a ground terminal between said input and output terminals of the PCB, apart from said input and output terminals by predetermined distances, a second terminal for the ground terminal vertically spaced from said input terminal, and a third terminal for the ground terminal vertically spaced from said output terminal, for respectively mounting the first, the second, and the third terminals of the ground terminal of the RF BPF thereon;
• and
• forming four holes into the PCB in the PCB thickness direction, between said input terminal and said first terminal, between said first terminal and said output terminal, between said input terminal and said second terminal, and between said output terminal and said third terminal.

A printed circuit board (PCB) for mounting a dielectric radio frequency (RF) band pass filter (BPF) thereon, the filter having an input terminal, an output terminal, and a ground terminal including at least a first, a second, and a third ground terminal, the PCB comprising:

• a first PCB terminal for mounting the input terminal of the RF BPF thereon;
• a second PCB terminal for mounting the output terminal of the RF BPF thereon;
• a third terminal for mounting the first terminal of the ground terminal of the RF BPF thereon, said third terminal disposed between said first and said second terminals;
• a fourth terminal for mounting the second terminal of the ground terminal of the RF BPF thereon, said fourth terminal disposed vertically apart from said first terminal by a predetermined distance;
• and
• a fifth terminal for mounting the third terminal of the ground terminal of the RF BPF thereon, said fifth terminal disposed vertically apart from said second pin by a predetermined distance, and wherein said third, said fourth and said fifth terminals are grounded;
• and
• a plurality of holes formed in the thickness direction of the PCB, wherein each of the plurality of holes is disposed between two of said PCB terminals.