Loading patent…
AssigneeNorthrop Grumman Corporation
InventorsJesse J. Kramer, Jeffrey R. Madura, Carl Richard Smith
Estimating the term…
A printed wiring board structure having at least one chip-carrying layer adjacent a core fabricated of an organic matrix having disposed therein continuous pitch based graphite fibers. The chip carrying layers and the core have an interface therebetween and are integrally connected to each other through vias plated with an electrically and thermally conductive material to thereby provide a plurality of connection sites along this interface. An organic matrix is preferably fabricated of a polymer material such as an epoxy resin. Preferred fibers are fabricated of pitch based graphite. A typically preferred present printed wiring board structure has several circuit layers and two chip-carrying layers each on opposite sides of the core, with each of the layers and the core having respective interfaces therebetween wherein each layer is integrally connected to the core at a plurality of connection sites, as required by circuit design, along the respective interfaces.
A printed wiring board structure comprising at least one chip-carrying layer adjacent a core fabricated of an organic matrix having disposed therein continuous pitch based graphite fibers, with said layer and said core having an interface therebetween and wherein the layer is integrally connected along said interface at a plurality of connection sites to the core at a plurality of vias each plated with a thermally and electrically conductive material and extending between the layer and the core.
Dependencies are inferred from the claim text.