System and method for sealing high density electronic circuits
AssigneeThe United States of America as represented by the Secretary of the Army
InventorGeorge K. Lucey, Jr.
Life of this patent
Estimating the term…
Abstract
A method and system for extending the life cycle of an circuit including the positioning of a circuit on an an elevated pedestal in a container, filling the container with a hydrophobic fluid sufficiently to form a bubble at the top of the package, and sealing the package. On the contamination of the container by a condensate, the pedestal segregates the circuit from the condensate regardless of the containers orientation.
Claims10
A method for extending a life cycle of a high density electronic circuit by isolation from detrimental contaminants, comprising the steps of:
- providing a container capable of being sealed,
- providing pedestal means positioned on the interior of the container,
- adding a hydrophobic liquid in an amount sufficient to immerse the electronic circuit and to form a compressible bubble at the top of the container, and
- sealing the container, so that on the contamination of the container, the elevated pedestal segregates the electronic circuit from a condensate regardless of the container orientation.
A system for extending a life cycle of an integrated circuit by isolation from contaminating condensates comprising:
- a sealable container comprising an interior,
- a pedestal positioned in the interior thereof,
- the pedestal suitable contoured to receive an electronic circuit, and
- a hydrophobic liquid in an amount sufficient to immerse the electronic circuit so as to form a compressible bubble at the top of the container,
- so that on contamination of the container by the condensate, the pedestal segregates the electronic electronic circuit from the condensate regardless of the container orientation.
Dependencies are inferred from the claim text.