Phenolic resin, resin composition, molding material for encapsulation, and electronic component device
AssigneeHitachi Chemical Company, Ltd.
InventorsHaruaki Sue, Shinsuke Hagiwara, Fumio Furusawa, Seiichi Akagi, Kazuyoshi Tendo
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Abstract
The present invention provides a resin containing in the backbone chain a structural unit represented by the following Formula (I) or (II), as a novel phenolic resin having a high Tg, a low moisture absorption, a low molding shrinkage, high adhesive properties and high flow properties. The present invention also provides a resin composition and a molding material each containing the above resin, and an electronic component device having a device element encapsulated with it.
Claims20
A phenolic resin containing in the backbone chain a structural unit represented by the following Formula (I).
A phenolic resin containing in the backbone chain a structural unit represented by the following Formula (II).
Dependencies are inferred from the claim text.