Heat-setting single-component LVA (low-viscosity adhesive) system for bonding in the micro-range

A thermally hardenable single-component adhesive system comprising:

• 85 to 93 weight percent of an epoxy casting resin;
• 4.5 to 12 weight percent of a polyhydroxy alcohol;
• 0.7 to 1.0 weight percent of a thermal initiator selected from a group consisting of onium salt and S-benzylthiolaniumhexafluoroantimonate;
• 0.3 to 0.6 weight percent of a bonding agent;
• 0 to 1.5 weight percent of a flow improver;
• 0 to 2.0 weight percent of a thixotropic agent;
• and
• 0 to 2.0 weight percent of a flow modifier.

A method for forming glued bonds with dimensional tolerances in the micrometer and sub-micrometer region, the method comprising the steps of:

• providing a thermally hardenable single-component adhesive system comprising:
• 60 to 98 weight percent of a casting resin;
• 2 to 30 weight percent of an alcohol or a sugar;
• 0.2 to 2.0 weight percent of a thermal initiator selected from a group consisting of S-benzylthiolaniumhexafluoroantimonate and onium salt;
• 0.2 to 2.0 weight percent of a bonding agent;
• 0 to 3.0 weight percent of a flow improver;
• 0 to 4.0 weight percent of a thixotropic agent;
• and
• 0 to 4.0 weight percent of a flow modifier;
• dosing the adhesive system onto components to be connected;
• and
• thermally hardening the adhesive system.