Epoxy and microsphere adhesive composition
AssigneeDaubert Chemical Company, Inc.
InventorMartin T. Hogan, III
Life of this patent
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Abstract
An adhesive composition, which comprises either an A- or B-side epoxy, and further includes a plurality of microspheres blended into either the A-side epoxy alone, the B-side epoxy alone, or into both. The microspheres of the invention are preferably made of a thermoplastic shell. As a result of the use of this adhesive between two substrates, a thin, strong bond may be formed between those two substrates. The bond is formed by a combination of an epoxy and a plurality of the microspheres. This epoxy and microsphere combination substantially inhibits seepage of the epoxy through the holes in a first, porous substrate.
Claims17
A two-part adhesive composition, comprising an epoxy as an A-side, and further comprising a B-side, of a polyamide resin, blended with said A-side, said composition further comprising microspheres blended into said epoxy, said microspheres present in said adhesive composition in an amount of between 0.02% (wt.) and 0.60% (wt.).
An adhesive composition, comprising an epoxy as an A-part, and further comprising a polyamide resin as a B-part, said adhesive further comprising a plurality of microspheres made of a thermoplastic shell encapsulating a gas.
A thin bond between two substrates, said two substrates comprising at least a first substrate having holes therein, which first substrate would normally be subject to liquid seepage when a liquid adhesive was used to bond those substrates, said bond being formed of a two-part epoxy composition and a plurality of microspheres added to said two-part epoxy composition, whereby said two-part epoxy and microsphere combination substantially inhibits seepage of said two-part epoxy through said holes in said first substrate.
An adhesive composition, comprising a two-part epoxy composition, and a plurality of microspheres blended into said epoxy, wherein said microspheres are made of a acrylonitrile copolymer, polyvinylidene chloride, borosilicate, or a phenolic material.
Dependencies are inferred from the claim text.