Processing compositions and methods of using same
AssigneeMicron Technology, Inc.
InventorBrian A. Vaartstra
Life of this patent
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Abstract
Compositions and methods for processing (e.g., cleaning) substrates, such as semiconductor-based substrates, as well as processing equipment, include one or more compounds of Formula (I): wherein each R1, R2, R3, and R4 is independently H or an organic group.
Claims20
A processing composition for use in fabricating semiconductor-based structures, the processing composition comprising a liquid carrier and a compound of the formula:
- wherein each R1, R2, R3, and R4 is independently H or an organic group and wherein the liquid carrier comprises water.
A processing composition for use in fabricating semiconductor-based structures, the processing composition comprising a liquid carrier and a compound of the formula:
- wherein each R1, R2, and R3 is independently H or an organic group, wherein the composition further comprises an abrasive component.
A processing composition for use in fabricating semiconductor-based structures, the processing composition comprising a liquid carrier and a compound of the formula:
- wherein each R1, R2, R3, and R4 is independently H or an organic group and wherein the liquid carrier consists essentially of water.
Dependencies are inferred from the claim text.