Reverse linear chemical mechanical polisher with loadable housing
AssigneeNutool, Inc.
InventorHomayoun Talieh
Life of this patent
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Abstract
The present invention is directed to a method and apparatus for polishing a surface of a semiconductor wafer using a pad moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad as the pad moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having a novel wafer loading and unloading method.
Claims20
An apparatus for polishing a surface of a wafer, comprising:
- a polishing pad;
- a support plate for supporting the polishing pad;
- and
- means for driving the polishing pad in a bi-directional linear movement as the pad polishes the surface of the wafer.
A method of polishing a surface of the wafer, comprising:
- positioning the wafer such that the surface of the wafer is exposed to a polishing pad;
- flowing a polishing solution between the wafer and the polishing pad;
- and
- polishing the surface of the wafer by moving the polishing pad bi-directional linearly.
A method of loading a wafer onto a cavity of a wafer housing having a movable pin housing and retractable pins disposed on a section of the pin housing, comprising:
- positioning the section of the pin housing below a surface of the wafer;
- extending retractable pins from the section of the pin housing, the pins thus providing support for the wafer that is insertable thereon;
- moving the pin housing so that the wafer is disposed near the wafer housing;
- loading the wafer onto the cavity of the wafer housing and off of the pins;
- retracting the pins into the section of the pin housing;
- and
- clearing the pin housing from the surface of the wafer.
A method of unloading a wafer from a cavity of a wafer housing having a movable pin housing and retractable pins disposed on a section of the pin housing, comprising:
- positioning the section of the pin housing below a surface of the wafer;
- extending retractable pins from the section of the pin housing, the pins thus providing support for the wafer that is insertable thereon;
- moving the pin housing so that the wafer is moved away from the cavity of the wafer housing;
- and
- unloading the wafer from the wafer housing by retracting the pins into the section of the pin housing.
A wafer housing for supporting a wafer, comprising:
- a cavity having a resting pad thereof;
- and
- a movable pin housing and retractable pins disposed on a section of the pin housing for loading and unloading the wafer from the wafer housing.
Dependencies are inferred from the claim text.