Method of forming a ball bond using a bonding capillary
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani
Life of this patent
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Abstract
A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.
Claims32
A method of forming a bump electrode on an IC electrode, comprising:
- operating a bonding capillary at a ball bond forming position to form a ball bond portion on an IC electrode;
- moving the bonding capillary upward with respect to the IC electrode;
- moving the bonding capillary sideways and then downward with respect to the IC electrode;
- bonding a wire to the ball bond portion such that no space is circumscribed by the wire and ball bond portion;
- and
- cutting the wire, the wire being prevented from coming in contact with portions around the ball bond portion other than the ball bond portion itself by presetting a descent position of the bonding capillary to a position higher than the ball bond forming position.
A method of forming a bump electrode on an IC electrode, comprising:
- operating a bonding capillary, having a capillary hole with a chamfered portion at a discharge end thereof, at a ball bond forming position to form a ball bond portion on an IC electrode;
- moving the bonding capillary upward with respect to the IC electrode;
- moving the bonding capillary sideways and then downward with respect to the IC electrode;
- bonding a wire to the ball bond portion;
- and
- cutting the wire, the wire being prevented from coming in contact with portions around the ball bond portion other than the ball bond portion itself by setting a chamfer angle of the chamfered portion of the capillary hole at not greater than 90 degrees to make the ball bond portion have a height greater than a diameter of the wire.
A method of forming a bump electrode on an IC electrode, comprising:
- operating a bonding capillary, having a capillary hole with a chamfered portion at a discharge end thereof, at a ball bond forming position to form a ball bond portion on an IC electrode;
- moving the bonding capillary upward with respect to the IC electrode;
- moving the bonding capillary sideways and then downward with respect to the IC electrode;
- bonding a wire to the ball bond portion;
- and
- cutting the wire, the wire being prevented from coming in contact with portions around the ball bond portion other than the ball bond portion itself by setting a chamfer diameter of the chamfered portion of the capillary hole greater than a diameter of the ball bond portion.
A method of forming a bump electrode on an IC electrode, comprising:
- operating a bonding capillary at a ball bond forming position to form an approximately conical ball bond portion on an IC electrode;
- moving the bonding capillary upward with respect to the IC electrode;
- moving the bonding capillary sideways and then downward with respect to the IC electrode;
- bonding a wire to the ball bond portion;
- and
- cutting the wire, the wire being prevented from coming in contact with portions around the ball bond portion other than the ball bond portion itself by making a tip end portion of an outer radius portion of the bonding capillary have a tapered thickness for concentration of a cutting force in a wire cutting stage against a sloped cone surface of the conical ball bond portion.
A method of forming a bump electrode on an IC electrode, comprising:
- operating a bonding capillary at a ball bond forming position to form an approximately conical ball bond portion on an IC electrode;
- moving the bonding capillary upward with respect to the IC electrode;
- moving the bonding capillary sideways and then downward with respect to the IC electrode;
- bonding a wire to the ball bond portion;
- and
- cutting the wire, the wire being prevented from coming in contact with portions around the ball bond portion other than the ball bond portion itself by setting an angle of an outer radius portion of the bonding capillary so that the outer radius portion is brought into uniform contact with a sloped cone surface of the conical ball bond portion.
Dependencies are inferred from the claim text.