Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and IC card

A semiconductor wafer, comprising:

• a substrate having a scribe line or a scribe line mark formed at a prescribed position and a plurality of circuit elements fabricated integrally;
• electrode bumps formed simultaneously with said scribe line or scribe line mark, on electrode pads conducting with respective said circuit elements;
• and
• an anisotropically conductive film stuck on said substrate to cover said electrode bumps and said scribe line or scribe line mark.

A method of manufacturing a semiconductor chip, comprising the steps of:

• fabricating a plurality of circuit elements integrally on a substrate:
• forming electrode bumps on electrode pads conducting to respective said circuit elements;
• forming a scribe line or scribe line mark at a prescribed position of said substrate;
• sticking an anisotropically conductive film to cover said electrode bumps and the scribe line or the scribe line mark;
• and
• dicing the semiconductor wafer formed through the above described steps said circuit element by circuit element using said scribe line or the scribe line mark as a reference mark;
• wherein
• said step of forming said electrode bumps and said step of forming the scribe line or the scribe line mark are performed simultaneously.

An IC card having a semiconductor chip, an insulating substrate on which the semiconductor chip is mounted and an antenna coil conducting to said semiconductor chip embedded in a resin card, wherein

• said semiconductor chip is obtained by dicing a semiconductor wafer including
• a substrate having a scribe line or a scribe line mark formed at a prescribed position and a plurality of circuit elements fabricated integrally,
• electrode bumps formed simultaneously with said scribe line or the scribe line mark on electrode pads conducting with said circuit elements,
• an anisotropically conductive film stuck on said substrate to cover each of said electrode bumps and said scribe line or the scribe line mark, said circuit element by circuit element using said scribe line or the scribe line mark as a reference mark.