Multi-chip module with stacked dice
AssigneeMicron Technology, Inc.
InventorsVenkateshwaran Vaiyapuri, Jicheng Yang
Life of this patent
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Abstract
A multi-chip module may be formed by wire bonding a first chip within a cavity in a multi-chip carrier. A second die may be positioned over the first die, elevated therefrom, using bump bonding. In some embodiments, only a single cavity is utilized and in other embodiments, multiple cavities may be utilized, one of which mounts a first chip and the other of which mounts a second chip. In some embodiments, the second chip may be a composite of two dice coupled back-to-back so that the lowermost die may be bump bonded to the carrier and the uppermost die, facing upwardly away from the carrier, may be wire bonded thereto.
Claims20
A method for making multi-chip modules comprising:
- positioning a first die with its backside in a first cavity formed in a surface of a structure;
- wire bonding the top side of a first die in said first cavity of said structure;
- bump bonding a second die to said surface of said structure over said first die;
- and
- attaching a solder ball to said structure such that said solder ball is electrically coupled to said first and second dice.
A method of coupling a pair of chips to a carrier comprising:
- positioning a first chip in a cavity on a first side of said carrier;
- wire bonding said first chip to said first side of said carrier;
- bump bonding a second chip to said first side outwardly with respect to said first chip.
A method of forming a multi-chip module comprising:
- securing a first chip in a cavity in a carrier;
- forming a second chip by securing a pair of dice together in back to back relationship;
- and
- securing said second chip to said carrier over said first chip.
Dependencies are inferred from the claim text.