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US 6,207,354 B1Granted
Method of making an organic chip carrier package
AssigneeInternational Business Machines Corporation
InventorsAnilkumar C. Bhatt, Thomas R. Miller, Allen F. Moring, James P. Walsh
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Abstract
A method of making a circuitized substrate wherein a chip-accommodating cavity is formed along with a plurality of conductive elements (e.g., pads, lines, etc.) which form part of the substrate's circuitry. Metallization is provided over the elements and, significantly, on the internal surfaces of the formed cavity to thereby enhance the electrical properties of the finished product, e.g., by assuring a solid, continuous path between upper and lower surfaces of the product.
Claims14
A method of making a circuitized substrate, said method comprising:
- providing an electrically insulative base member having first and second opposing surfaces;
- depositing a first layer of metallization onto each of said first and second opposing surfaces of said base member,
- removing a selected portion of said base member to form an open cavity therein having sidewalls;
- depositing a second layer of metallization onto said first layer of metallization on said first and second surfaces of said base member and onto said sidewalls of said open cavity;
- depositing a layer of photoimaging material onto said second layer of metallization on said first and second opposing surfaces of said base member and said sidewalls;
- exposing selected portions of said layer of photoimaging material to define circuit patterns comprised of said first and second layers of metallization on said first and second opposing surfaces;
- removing selected portions of said photoimaging material to expose said circuit patterns on said first and second opposing surfaces while not removing photoimaging material on said sidewalls;
- removing said exposed first and second layers of metallization to form said circuit patterns on said first and second opposing surfaces;
- and
- substantially removing any remaining photoimaging material on said sidewalls and said second layer of metallization.
7 more elements
Dependencies are inferred from the claim text.