Laminate film and processes for preparing printed wiring board
AssigneeHitachi Chemical Company, Ltd.
InventorsNoriyo Kimura, Youji Tanaka, Kazutaka Masaoka, Takafumi Kudou, Yukihiko Minamihira, Tetsuo Yoshida
Life of this patent
Estimating the term…
Abstract
Provided are a laminate film which comprises a photosensitive layer and a first film having a 5% elongation load in the longitudinal direction of the film per unit width at 80° C. of 4 to 90 g/mm and a breaking elongation in the longitudinal direction of the film per unit width of 50 to 1,000%, and processes for preparing a printed wiring board, which comprises laminating the laminate film on a substrate so that the photosensitive layer and the substrate are contacted with each other; and then subjecting a resulting material to exposure and development.
Claims35
A laminate film which comprises a photosensitive layer and a first film having a 5% elongation load in the longitudinal direction of the film per unit width at 80° C. of 8 to 30 g/mm and a breaking elongation in the longitudinal direction of the film per unit width of 50 to 1,000%.
A laminate film which comprises a photosensitive layer and a first film having a 5% elongation load in the longitudinal direction of the film per unit width at 80° C. of 4 to 90 g/mm and an oxygen permeation amount of 400 ml/m2·24h·atm or less.
A laminate film which comprises a photosensitive layer and a first film having a 5% elongation load in the longitudinal direction of the film per unit width at 80° C. of 4 to 90 g/mm and an Elemendorf tear strength of 4.5 kg/cm or more.
A laminate film which comprises a photosensitive layer and a first film having a 5% elongation load in the longitudinal direction of the film per unit width at 80° C. of 4 to 90 g/mm and a refractive index of 1.55 or more.
Dependencies are inferred from the claim text.