Method of forming silicon oxy-nitride films by plasma-enhanced chemical vapor deposition
AssigneeApplied Materials, Inc.
InventorsKam Law, Jeff Olsen
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Abstract
An improved method of producing silicon oxy-nitride films is provided by utilizing a reactant gas mixture of silane, nitrous oxide and nitrogen at a low deposition temperature of less than 250° C. by flowing the reactant gas mixture through a gas inlet manifold which is also an upper electrode in a plasma-enhanced chemical vapor deposition chamber. The gas inlet manifold is the upper plate of a parallel plate plasma chamber for communicating the reactant gas into the chamber. The plate has a plurality of apertures, each comprising an outlet at a chamber or processing side of the plate and an inlet spaced from the processing side, with the outlet being larger than the inlet for enhancing the dissociation and reactivity of the gas.
Claims5
A substrate having a substantially ammonia-free silicon oxynitride passivation film having a refractive index of between 1.5 and 1.9 and a wet etch rate of below about 3000 angstroms per minute deposited thereon by a chemical vapor deposition method comprising
- employing a first and second electrode for reacting at a deposition temperature of less than about 250° C. and at a deposition pressure of between about 0.5 and 3.5 Torr a reaction gas mixture of silane, nitrogen and nitrous oxide that is substantially ammonia free, whereby a separation of said first and second electrodes is substantially less than a lateral size of said substrate to preclude the use of magnetic field enhancement with said method for depositing.
Dependencies are inferred from the claim text.