Connector surface-treated with a Sn-Ni alloy
AssigneeJapan Solderless Terminal Mfg. Co., Ltd.
InventorKunihiko Fukui
Life of this patent
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Abstract
A tin-nickel alloy containing not less than 75 wt % and less than 100 wt % of tin with the balance of nickel. The alloy is used, for example, for formation of a surface treatment layer of an electronic component which is to be soldered onto a substrate with the use of the surface mount technology. The surface treatment layer preferably has a thickness of not less than 0.1 μm and less than 0.5 μm. The electronic component preferably further includes a nickel deposit layer as an underlying layer interposed between a base of the component and the surface treatment layer.
Claims7
A connector for an electrical component, comprising:
- a resin material which constitutes a housing of said connector for the electrical component;
- a metal shell, covering at least a part of said resin housing;
- an electrical contact, which comprises a base;
- and
- a surface treatment layer covering a portion of said metal shell and a portion of the base of said electrical contact, formed of a tin-nickel alloy containing not less than 75 wt % and less than 100 wt % of tin with the balance of nickel.
Dependencies are inferred from the claim text.