Transfer sheet, and pattern-forming method

Abstract

A transfer sheet and a pattern-forming method suitable for forming high-precision patterns for layers such as electrode layers, dielectric layers and barrier layers in the process of producing plasma display panels, image display devices, thermal heads, integrated circuits, etc., and capable of forming patterns having superior surface smoothness, a uniform thickness and high profile precision in a reduced period of time and in high yields. The transfer sheet has an ink layer over a base film. The ink layer consists essentially of an inorganic component containing at least a glass frit, and a thermoplastic resin. The ink layer contains from 3 parts to 50 parts by weight of the thermoplastic resin with respect to 100 parts by weight of the inorganic component. According to the pattern-forming method, a pattern is transferred onto a substrate by using the transfer sheet, and then firing is carried out, thereby forming a high-precision pattern, e.g. an electrode layer, a dielectric layer, a barrier layer, etc.

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