Non-ionic circuit board masking agent
AssigneeIllinois Tool Works Inc.
InventorsJohn W. Holdren, II, Eric Martini
Life of this patent
Estimating the term…
Abstract
A water soluble, non-ionic masking agent is used in the manufacture of printed circuit boards. The masking agent masks portions of the circuit board to prevent adhesion of solder, flux and the like. The masking agent includes a water soluble non-ionic binder resin, a cellulosic non-ionic filler, a non-ionic surfactant, at least one non-ionic associative thickener, and deionized water. The masking agent material is readily removed from the circuit board after manufacture and does not render further wash water processing ineffective. The masking agent is non-ionic, and thus does not agglomerate or clump downstream ion-exchange or filtration media.
Claims14
A water soluble, non-ionic masking agent for use in the manufacture of printed circuit boards, comprising:
- a water soluble non-ionic binder resin;
- a cellulosic non-ionic filler;
- a non-ionic surfactant;
- a non-ionic associative thickener;
- and
- deionized water.
A water soluble, non-ionic masking agent for use in manufacturing printed circuit boards consisting essentially of:
- a water soluble, non-ionic binder in a weight percent of about 55 to about 70 percent;
- a non-ionic filler in a weight percent of about 10 to about 30 percent;
- a non-ionic surfactant in a weight percent of about 1.0 to about 4.0 percent;
- a non-ionic associative thickener in a weight percent of about 2.0 to about 10 percent;
- and
- deionized water in a weight percent of about 1.0 to about 32 percent.
Dependencies are inferred from the claim text.