Method for manufacturing a molding tool used for sustrate molding
AssigneeNikon Corporation
InventorShiji Morita
Life of this patent
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Abstract
The invention relates to methods for making mold tools. More particularly, the mold tools are used for molding a resin substrate which has fine pits, i.e., concavities and protuberances. The invention also pertains to a method for manufacturing a resin substrate. Such resin substrates may be used as an optical disk, a magnetic disk, a hard disk, etc., for recording data. According to a preferred embodiment of the invention, a first metallic (Ni) mold tool (father) is made which is a duplicate of a master substrate, then a resin mold tool (mother) is made which is a duplicate of the first metallic mold tool and finally a second metallic (Ni) mold tool (son) is made which is a duplicate of the resin mold tool. Both the father and son may be referred to “as a stamper”.
Claims30
A method of manufacturing a mold tool for molding a substrate comprising:
- (a) preparing a master substrate having at least one surface containing minute concavities and protuberances;
- (b) forming a first nickel or nickel alloy mold tool on the master substrate by electrotype duplication;
- (c) peeling the first mold tool from the master substrate;
- (d) forming a resin layer on the first mold tool;
- (e) hardening or curing the resin layer to form a hardened or cured resin mold tool;
- (f) peeling the resin mold tool from the first mold tool;
- (g) forming a second nickel or nickel alloy mold tool on the resin mold tool by electrotype duplication;
- and
- (h) peeling the second mold tool from the resin mold tool, wherein the second mold tool has a surface containing minute concavities and protuberances corresponding to those on the surface of the master substrate.
A nickel or nickel alloy mold tool having a surface roughness (Ra) of about 1 nm or less.
A nickel or nickel alloy mold tool having a surface waviness (Wa) of about 1 nm or less.
An injection molded resin substrate having a diameter of about 50 mm to about 130 mm and a surface waviness (Wa) of about 1 nm or less.
A method for manufacturing a son stamper for molding a substrate, comprising:
- (a) preparing a master substrate having a surface containing minute concavities and protuberances;
- (b) forming father stamper on the master substrate by electrotype duplication;
- (c) peeling the father stamper from the master substrate;
- (d) forming a resin layer on the father stamper;
- (e) hardening or curing the resin layer to form a hardened or cured resin mold tool;
- (f) peeling the resin mold tool from the father stamper;
- (g) forming a son stamper on the resin mold tool by electrotype duplication;
- and
- (h) peeling the son stamper from the resin mold tool,
- wherein the son stamper has a surface containing minute concavities and protuberances corresponding to those on the surface of the master substrate.
Dependencies are inferred from the claim text.