Process for producing a metal-ceramic substrate and a metal-ceramic substrate
OwnerJürgen Schulz-Harderinventor
Life of this patent
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Abstract
The invention relates to a novel process for producing a ceramic-metal substrate for electrical circuits in which a first or second metal coating is applied to a ceramic layer on both sides, specifically first metal coating in the form of a copper foil using the DCB process.
Claims18
A process for producing a ceramic-metal substrate for electrical circuits, said substrate having a ceramic layer and first and second metal coatings, each applied on one side to the ceramic layer and at least one through metal bonding provided in the area of at least one opening in the ceramic layer and connecting the first and second metal coatings, said process comprising:
- applying a copper foil by using the DCB-process to one side of the ceramic layer as the first metal coating, and
- after that, forming the second metal coating by applying a conductor paste which contains at least the metal of the second metal coating, an organic binder and a glass component on to the other surface side of the ceramic layer and also into the at least one opening and on to a surface of the first metal coating which is exposed in said at least one opening or around said at least one opening, by drying and firing the applied conductor paste, the paste forming a glass layer between said ceramic layer and said second metal coating and no glass layer being formed between said second metal coating and said first metal coating.
A process for producing a multiple ceramic substrate arrangement comprising a plurality of individual substrates formed on a large-format ceramic plate, said process comprising:
- applying the first metal coating in a form of a copper foil on one surface side of the ceramic plate using the DCB-process,
- providing the ceramic plate with scored lines at least on the other surface side of the ceramic layer in between the individual substrate;
- and
- applying a second metal coating to said other surface side of the ceramic plate in a thick film or thin film comprising the steps of:
- applying a conductor paste which contains at least a metal of the second metal coating, an organic binder and a glass component to overlap all said scored lines and with a thickness much smaller than that of the first metal coating, and drying and firing the applied conductor paste.
A process for producing a ceramic-metal substrate for electric circuits, the substrate comprising a ceramic layer with first and second metal coatings each applied on one side of the ceramic layer and at least one through metal plating provided in an area of at least one opening in the ceramic layer and connecting the first and second metal coatings, the process comprising the steps of:
- applying a copper foil to one side of the ceramic layer as the first metal coating by a direct copper bonding process;
- after that applying the second metal coating to the other side of the ceramic layer and forming the at least one through metal plating using a paste, which contains a metal of the second metal coating an organic binder and a glass component to other side of the ceramic layer and said at least one through metal bonding in a one step in a thick film or thin film;
- and
- applying the second metal coating into the at least one opening and onto a surface of the first metal coating which is exposed in the at least one opening.
Dependencies are inferred from the claim text.