Sputtering device with a cathode with permanent magnet system

A sputtering device with magnetic amplification comprising a permanent magnet system formed of a plurality of permanent magnets located on a side of a target that faces away from a sputtering surface of said target and for generating a magnetic field, whose lines of force run above and penetrate said sputtering surface, with a cathode that is formed at least in part by said sputtering surface;

• and with an anode located at a distance from said cathode for generation of an electric field, whereby said permanent magnets form a configuration of two closed, coaxial circular or oval rows of a plurality of individual magnets that are connected with each other by means of a magnetic yoke and between said two rows of a plurality of individual magnets there is a U-shaped insert of ferromagnetic material with a configuration fitted to that of said yoke and having a rear horizontal surface that faces away from said target and lies against a surface of said magnetic yoke that faces said target and is bounded by the two rows of permanent magnets whereby two vertical arms of the U-shaped insert each extend at a distance (a, b) from the two rows of permanent magnets in a direction toward said target, said U-shaped insert being confined radially to an area between said two rows of said plurality of individual magnets.