Method for producing thin IC cards and construction thereof
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorYasuhiro Murasawa
Life of this patent
Estimating the term…
Abstract
A method for mass producing thin IC cards having beautiful surfaces using a non-polluting polyethylene telephthalate material in which a hot-melt type adhesive is applied and formed on a joint surface of a cover sheet formed from polyethylene telephthalate, and in which a hot-melt adhesive is used as a sealing adhesive at an opening of a core sheet that is held by the cover sheets. To improve the heat-resisting bonding strength of this hot-melt adhesive, a thermosetting resin may be mixed with the hot-melt adhesive.
Claims9
A method for producing a thin IC card that includes a cover sheet, a core sheet having apertures for housing electronic components, and a circuit pattern sheet whereon a wiring pattern is formed and electronic components are mounted, comprising:
- laminating the core sheet on the circuit pattern sheet so that the electronic components mounted on the circuit pattern sheet are located at the positions of the apertures;
- filling the apertures housing the electronic components with hot-melt sealing adhesive;
- providing the cover sheet on the laminate of the circuit pattern sheet and the core sheet, said cover sheet being provided on one side of the circuit pattern sheet;
- applying heat and pressure to bond the cover sheet and the core sheet, after said filling the apertures housing the electronic components with hot-melt sealing adhesive, via a hot-melt bonding adhesive layer formed on at least one opposing bonding surface, such that said hot-melt bonding adhesive layer and the previously provided hot-melt sealing adhesive fuse during bonding;
- and
- cutting the laminate to a predetermined size.
A thin IC card comprising:
- a cover sheet;
- a core sheet having apertures for housing electronic components, the core sheet having a front side and back side;
- a circuit pattern sheet with a wiring pattern and the electronic components mounted thereon;
- and
- another cover sheet,
- wherein said cover sheet, said core sheet, said circuit pattern sheet, and said another cover sheet are laminated, spaces in the apertures of the core sheet around the electronic components are filled with a hot-melt sealing adhesive that includes thermosetting resin, and the cover sheets are bonded via a hot-melt adhesive bonding layer that includes thermosetting resin formed on bonding surfaces of the front and back sides of the core sheet and that is fused with the hot-melt sealing adhesive.
Dependencies are inferred from the claim text.