Chemical vapor deposition system and method

A chemical vapor deposition system for processing substrates, the system comprising:

• (a) a muffle having a chamber with an injector assembly adapted to inject a chemical vapor into the chamber to react on a surface of the substrate;
• (b) a belt adapted to move the substrates to be processed through the muffle into the chamber;
• and
• (c) means for reducing formation of deposits on a surface of the belt so that a mean time between muffle etches (MTBME) is increased said means comprising an oxidation-resistant coating including nickel aluminide.

A chemical vapor deposition system for processing substrates, the system comprising:

• (a) a muffle having at least one chamber with an injector assembly adapted to inject a chemical vapor into the chamber to process the substrates;
• (b) a belt adapted to move the substrates to be processed through the muffle into the chamber;
• and
• (c) an exhaust system adapted to exhaust spent chemical vapor from the muffle,
• wherein at least one of the belt, the muffle and the exhaust system have an oxidation-resistant coating so that formation of deposits thereon and generation of particles is reduced, the oxidation-resistant coating comprising nickel aluminide.