Wafer carrier head for prevention of unintentional semiconductor wafer rotation

Abstract

The present invention provides a method of manufacturing an integrated circuit using a polishing head in a semiconductor wafer polishing apparatus. The polishing head preferably comprises a wafer carrier head and a protuberance coupled to the wafer carrier head. The wafer carrier head has a back surface that contacts the wafer when it is positioned within the carrier head and a carrier ring depends from the carrier head to form an annulus. The annulus has an inner surface, which is typically an inner surface of the carrier ring, and it forms a cavity with the wafer carrier head that is configured to receive a semiconductor wafer therein. The protuberance is located within the annulus proximate the inner surface and is configured to cooperate with a concavity in a periphery of the semiconductor wafer. This cooperation prevents the semiconductor wafer from rotating with respect to the wafer carrier head during polishing of the semiconductor wafer.

Dependencies are inferred from the claim text.