Method for increasing working life of retaining ring in chemical-mechanical polishing machine
AssigneeUnited Microelectronics Corp.
InventorsChien-Hsin Lai, Juen-Kuen Lin, Peng-Yih Peng
Life of this patent
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Abstract
A method for increasing the working life of retaining rings in a chemical-mechanical polishing machine. The method includes adding an extra pad between a retaining ring and a carrier so that the retaining ring is prevented from slippage and pressure on wafer can be evenly spread over the polishing pad of a polishing machine. Therefore, the rate at which a retaining ring wears out in chemical-mechanical polishing operation can be greatly reduced, and the working life of a retaining ring can be doubled.
Claims11
A method for increasing the working life of retaining rings in a chemical-mechanical polishing machine where the polishing machine includes a carrier and a retaining ring for grabbing a wafer firmly when the chemical-mechanical polishing machine is in operation, the method comprising:
- placing an additional pad between the carrier and the retaining ring to allow an adjustment in position of the wafer with respect to the retaining ring so that a gap between the bottom surface of the wafer and the bottom surface of the retaining ring can be maintained within a predetermined range.
A chemical-mechanic polishing machine, comprising:
- a polishing table, having a first speed for polishing a wafer;
- a slurry transporting pipe, to provide slurry onto the polishing table;
- a carrier, to carrier the wafer during polishing;
- a retainer ring, to retain the wafer under the carrier during polishing;
- a pad, to stabilize the retain ring and to spread out pressure during polishing;
- and
- a rotating axle, having a second speed for rotating the wafer during polishing.
Dependencies are inferred from the claim text.