Through via plate electrical connector and method of manufacture thereof

Abstract

For use with a plate having a via located therethrough an electrical connector configured to transfer an electrical signal from one major surface of a plate to the other major surface, a method of manufacturing the electrical connector and a board mounted power supply utilizing the same. In one embodiment, the electrical connector comprises a dielectric layer coating a peripheral wall of the via and extending therefrom to coat portions of the opposing major surfaces of the plate adjacent the via. The electrical connector further comprises a conductive contact layer that covers a portion of the dielectric layer and extends to portions of the opposing major surfaces to form opposing contacts thereon.

Dependencies are inferred from the claim text.