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AssigneeInternational Business Machines Corporation
InventorsBrian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Da-Yuan Shih
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The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are formed by cutting with one or more blades. The shape of the blades determines the shape of the probetips. The probetips can be coated with other conductive materials to enhance the hardness and profile of protuberances formed at the probetip ends by the blade-cutting process. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer. The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
A method comprising:
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A method comprising:
Dependencies are inferred from the claim text.