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US 6,206,272 B1Granted
Alignment weight for floating field pin design
AssigneeIntel Corporation
InventorsCheryl M. Waldron-Floyde, Brad C. Irwin
Life of this patent
Estimating the term…
Abstract
An alignment weight is provided. The alignment weight includes a body of material having first and second opposing surfaces. A number of depressions are formed in the first surface. The depressions receive pins of a floating pin field when placed on a floating pin field during connection of the floating pin field to a printed circuit board.
Claims12
A method for coupling a floating pin field with a printed circuit board, the method comprising:
- disposing a bonding material on selected portions of a surface of the printed circuit board;
- placing a plurality of pins in a field carrier;
- placing the field carrier and pins on the printed circuit board with the pins selectively aligned with the bonding material;
- placing an alignment weight on the pins of the pin field carrier such that the pins align with depressions in a surface of the alignment weight;
- and
- heating the bonding material to couple the pins with the circuit board.
3 more elements
A method for coupling a floating pin field with a printed circuit board, the comprising:
- disposing a solder material on selected portions of a surface of the printed circuit board;
- placing a plurality of pins in a field carrier;
- placing the field carrier and pins on the printed circuit board with the pins selectively aligned with the solder material;
- placing an alignment weight on the pins of the pin field carrier such that the pins align with depressions in a surface, along a perimeter of the alignment weight;
- heating the solder material to couple the pins with the circuit board;
- and
- coupling a microprocessor circuit to the printed circuit board.
4 more elements
Dependencies are inferred from the claim text.