Full coverage thermal couple

A circuit board ball grid array (BGA) solder joint profiling arrangement comprising:

• a thin element with length and width dimensions generally corresponding to the length and width dimensions of the BGA and with a registration portion for registering the position of the thin element with the solder pads on the circuit board and for providing an indication of locations on the thin element corresponding to locations on the BGA;
• thermal couple probes attached to the element, the thermal couples being positioned at locations of said thin element corresponding to critical locations of the circuit board requiring profiling based on the indication of locations provided by said registration portion, the element being disposed on the BGA and secured in position based on the registration portion such that the thermal couples are positioned corresponding to the critical locations requiring profiling.

A ball array (BGA)/circuit board solder joint profiling arranging comprising:

• a tape element with length and width dimensions generally corresponding to the length and width dimensions of the BGA and with a plurality of holes, each hole being of a size to go over a solder bump on the circuit board;
• a plurality of thermal couple probes attached to the element, the thermal couples probes being positioned of locations corresponding to critical location of the circuit board requiring profiling, the element being disposed on the BGA and secured in position relative to the holes with each hole receiving a solder bump such that the thermal couples probes are positioned relative to the BGA corresponding to the critical location requiring profiling.