Control method for wire bonding apparatus

A method for a wire bonding apparatus that comprises:

• a supporting frame, a bonding arm which has a bonding tool at one end and is supported on said supporting frame by a cross-shaped spring such that said bonding arm is pivotally moveable upward and downward about said cross-shaped spring, a linear motor which raises and lowers the bonding arm, a position detection section which detects the height position of the bonding arm and converts this height position into electrical signal pulses, a memory, a computer which calculates the height position of the bonding tool by processing said electric signal pulses from the position detection section, and a position control section which maintains the height position of the bonding tool and controls the movement of the bonding tool, wherein the method stores positional deviation correction values in said memory, corrects stopping position deviations in height positions of said bonding tool in response to selected positional deviation values stored in said memory, controls said position control section according to said selected positional deviation correction values, and then corrects stopping position deviations in said height positions of said bonding tool.