Automated substrate processing systems and methods

A system for processing a substrate, comprising:

• a vacuum chamber;
• a substrate support located inside the vacuum chamber and constructed and arranged to support a substrate during processing;
• and
• a substrate alignment detector including a vibration detector coupled to the substrate support.

A system for processing substrates, comprising:

• a vacuum chamber;
• a substrate support located inside the vacuum chamber and movable toward and away from a substrate positioned inside the vacuum chamber;
• a substrate aligner having one or more alignment pins for aligning the substrate with respect to the substrate support, the substrate aligner being movable toward and away from the substrate positioned inside the vacuum chamber, the alignment pins being constructed and arranged to contact a substrate that is misaligned with respect to the substrate support and to guide the misaligned substrate into alignment;
• and
• a substrate alignment detector having one or more vibration detectors for detecting if the substrate contacts the one or more alignment pins of the substrate aligner.

A system for processing substrates, comprising:

• a vacuum chamber;
• a transfer arm for carrying a substrate into and out of the vacuum chamber;
• a substrate support located inside the vacuum chamber and movable toward and away from the substrate carried by the transfer arm;
• a substrate aligner having at least one alignment pin for aligning the substrate with respect to the substrate support, the substrate aligner being movable toward and away from the substrate carried by the transfer arm, said alignment pin being constructed and arranged to contact a substrate that is misaligned with respect to the substrate support and to guide the misaligned substrate into alignment;
• and
• a substrate alignment detector having one or more vibration detectors for detecting if the substrate contacts the one or more alignment pins of the substrate aligner.

A method for processing substrates, comprising:

• transferring a substrate into a vacuum chamber that has a substrate support for supporting a substrate during processing;
• recording the position of the substrate as it is being transferred into the vacuum chamber;
• detecting if the substrate is misaligned with respect to the substrate support;
• processing the substrate;
• unloading the processed substrate from the vacuum chamber;
• recording the position of the processed substrate as it is being unloaded from the vacuum chamber;
• and
• compensating for any substrate misalignment based upon the difference in the recorded substrate positions.