Method for vacuum fusion bonding
AssigneeThe Regents of the University of California
InventorsHarold D. Ackler, Stefan P. Swierkowski, Lisa A. Tarte, Randall K. Hicks
Life of this patent
Estimating the term…
Abstract
An improved vacuum fusion bonding structure and process for aligned bonding of large area glass plates, patterned with microchannels and access holes and slots, for elevated glass fusion temperatures. Vacuum pumpout of all components is through the bottom platform which yields an untouched, defect free top surface which greatly improves optical access through this smooth surface. Also, a completely non-adherent interlayer, such as graphite, with alignment and location features is located between the main steel platform and the glass plate pair, which makes large improvements in quality, yield, and ease of use, and enables aligned bonding of very large glass structures.
Claims11
In a method for vacuum fusion bonding of moderate melting point substrates having a gradual softening point curve, the improvement comprising:
- providing a base platform with a flat upper surface,
- providing the base platform with at least one vacuum pumpout port,
- providing the base platform with a vacuum pumpout slot connecting said port to said flat surface,
- providing a non-adherent interlayer having openings therein on the flat surface of the base platform,
- aligning the openings in the interlayer with the slot in the base platform,
- positioning a pair of substrates having openings therein to be bonded on the interlayer,
- applying a clamping means to the pair of substrates on the interlayer such that the openings therein are in fluid communication with the openings the interlayer,
- applying a vacuum to the vacuum pumpout port which causes the pair of substrates to be drawn together, and
- removing the clamping means prior to fusion bonding of the substrates.
A vacuum fusion bonding method, comprising:
- providing a base platform having a surface,
- providing at least one vacuum pumpout port in the base platform,
- providing an interconnecting slot between the pumpout port and the surface of the base platform,
- providing a non-adherent interlayer having at least one opening therein on the surface of the base platform,
- aligning the at least one opening in the interlayer with the slot in the base platform,
- positioning a pair of substrates, each having at least one opening therein, on the surface of the base platform,
- aligning at least one opening in one of the pair of substrates with the at least one opening in the interlayer,
- providing a device for clamping the pair of substrates on the surface of the base platform,
- applying a vacuum to the pumpout port causing the pair of substrates to be drawn together,
- removing the clamping device whereby the pair of substrates are drawn together by the applied vacuum, and
- fusion bonding the substrates together.
Dependencies are inferred from the claim text.