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US 6,205,799 B1Granted
Spray cooling system
AssigneeHewlett-Packard Company
InventorsChandrakant D. Patel, Cullen Bash
Life of this patent
Estimating the term…
Abstract
A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roil bond panel, or other heat exchanger, and is pumped into a spring loaded reservoir that feeds the spray device.
Claims20
A cooling assembly for cooling a semiconductor with a cooling fluid, comprising:
- an incremental sprayer configured to eject an incremental amount of the cooling fluid on the semiconductor in response to a control signal;
- and
- a controller configured to send the control signal to the incremental sprayer.
A cooled circuit board, comprising:
- a circuit board;
- a semiconductor device mounted on the circuit board;
- and
- a cooling assembly configured to cool the semiconductor device with a cooling fluid, wherein the cooling assembly includes an incremental sprayer configured to eject an incremental amount of the cooling fluid on the semiconductor device in response to a control signal and wherein the cooling assembly includes a controller configured to send the control signal to the incremental sprayer.
1 more element
A cooled circuit board assembly, comprising:
- a plurality of cooled circuit boards, each circuit board comprising:
- a circuit board;
- a semiconductor device mounted on the circuit board;
- and
- a cooling assembly configured to cool the semiconductor device with a cooling fluid, wherein the cooling assembly includes an incremental sprayer configured to eject an incremental amount of the cooling fluid on the semiconductor device in response to a control signal, and wherein the cooling assembly includes a controller configured to send the control signal to the incremental sprayer;
- a heat exchanger configured to cool and condense cooling fluid that was vaporized by the semiconductor device of each of the plurality of cooled circuit boards after being ejected by the incremental sprayer;
- a reservoir configured to provide liquid cooling fluid to the incremental sprayer of each of the plurality of cooled circuit boards;
- and
- a pump configured to pump liquid cooling fluid from the heat exchanger to the reservoir.
6 more elements
A method of cooling a semiconductor comprising:
- ejecting an incremental amount of a cooling fluid onto the semiconductor using an incremental sprayer;
- and
- repeating the step of ejecting at time increments.
Dependencies are inferred from the claim text.