Method for formation of metal wiring
AssigneeNEC Corporation
InventorMasaya Kawano
Life of this patent
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Abstract
A metal wiring forming process in which an insulating film is formed on the principal surface of a substrate. Grooves or via holes are formed in the insulating layer and then a barrier film and a metal film in this order are formed on the substrate. Thereafter, the principal surface of the resulting substrate is smoothed until the insulating film is exposed completely and the grooves or via holes are filled with the metal film. The surface smoothing process includes a first polishing stage of conducting chemical mechanical polishing until the surface of the barrier film is exposed, and a second polishing stage of conducting mechanical polishing to polish the whole resulting surface at a constant rate.
Claims7
A method for formation of metal wiring, which comprises at least:
- a step of forming an insulating film on the principal surface of a substrate,
- a step of forming, in the insulating film, grooves or via holes,
- a step of forming, on the whole principal surface of the resulting substrate, a barrier film and a metal film in this order, and
- a step of flattening the principal surface of the resulting substrate until the insulating film is exposed completely, to fill the grooves or via holes with the metal film,
- wherein the surface flattening consists of:
- a first polishing stage of conducting chemical mechanical polishing until the surface of the barrier film is exposed, and
- a second polishing stage of conducting mechanical polishing to polish the whole resulting surface at a constant rate.
Dependencies are inferred from the claim text.