Method of manufacturing a surface mount package

A method of manufacture of a high density, integrated circuit module, of the type including surface mount integrated circuit packages, comprising the steps of:

• (a) providing first and second integrated circuit packages, each having a bottom surface and a top surface, with a plurality of package leads extending from the bottom surface;
• (b) providing a lead carrier, wherein said lead carrier is comprised of a plurality of electrically and thermally conductive elements, each of said conductive elements is formed having a package lead connection portion adapted to receive one of said package leads and an interconnect portion that provides an electrical connection to one of said package leads;
• (c) mounting said second package to the first package, so that the top surface of the second package is adjacent to the top surface of the first package;
• and
• (d) mounting the lead carrier to the bottom surface of said second package, wherein selective package leads of said second package are received by corresponding package lead connection portions of the lead carrier forming a multiple package module.