Method of making ultrasonically welded, staked of swaged components in an implantable medical device
AssigneeMedtronic, Inc.
InventorsDaniel C. Haeg, Craig L. Wiklund, James F. Kelley
Life of this patent
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AssigneeMedtronic, Inc.
InventorsDaniel C. Haeg, Craig L. Wiklund, James F. Kelley
Estimating the term…
The present invention generally relates to implantable medical devices and more particularly to various means for ultrasonically welding, swaging or staking various components in an implantable medical device, most preferably by employing appropriately configured covers or lids. Covers or lids are attached to header or connector modules mounted on an hermetically enclosed and sealed enclosure, where the connector or header module and enclosure comprise an implantable medical device. The covers or lids preferably trap or otherwise secure any of a number of various connector or header module components within the header or connector modules. Examples of such trapped or secured components include grommets, set screw connector blocks, seals, feedthrough wires, multi-beam contacts, electrical contacts, antennas, radio-opaque markers, connector ribbons and the like.
A method of securing at least one component within a pre-formed module including a pre-formed header module and a connector module attached to a hermetically sealed enclosure of an implantable medical device, wherein said hermetically sealed enclosure is formed with a plurality of electrical feedthrough, each feedthrough having a feedthrough pin extending through an enclosure wall for attachment with a like plurality of connector components located within a like plurality of component recesses, including making an electrical connection which comprises the steps of:
Dependencies are inferred from the claim text.