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US 6,205,264 B1Granted
Optical assembly with improved dimensional stability
AssigneeLucent Technologies Inc.
InventorsSungho Jin, Hareesh Mavoori
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AssigneeLucent Technologies Inc.
InventorsSungho Jin, Hareesh Mavoori
Estimating the term…
Aligned Optoelectronic assembly with improved dimensional stability is disclosed. The assembly is carried out with a bonding material, either a solder or an adhesive, which contain insoluble, non-coarsening dispersoid particles. New solder compositions having enhanced mechanical properties are described. Relatively inert particles having a diameter of 5000 nm or less are dispersed in a solder material having an average grain size of approximately 10,000 nm or less to produce such solder compositions. The dispersed particles act as physical barriers in solders substantially impeding the motion of grain boundaries and inhibiting grain growth during thermal and stress cycling which substantially inhibits coarsening. As a consequence, the optoelectronic device assembly according to the invention exhibit substantially improved dimensional stability, with the rate of creep deformation at the joint reduced by a factor of at least two.
An optical assembly comprising at least one optical element and at least one support element, said optical element bonded to said support element with a bonding material comprising at least 0.5% by volume of non-magnetic dispersoid particles insoluble in said bonding material, said particles having an average size less than about 5000 nm for providing said bonding material with an improved creep resistance having a steady state creep rate of at most 50% of the creep rate of the bonding material without said dispersoid particles.
A method of interconnecting first and second components, at least one of the components being an optical component, comprising the steps of:
Dependencies are inferred from the claim text.