Low temperature co-fired ceramic with improved registration

A multilayered low temperature co-fired ceramic assembly with high density circuit features, comprising:

• a) a planar ceramic core that is fired in a first firing including:
• a1) at least a first and a second ceramic layers;
• a2) a plurality of via holes located in the first and second ceramic layers;
• and
• a3) a plurality of low density circuit features located on the first and second layers;
• a4) the ceramic core shrinking in three axes during the first firing;
• and
• b) at least a third and a fourth planar ceramic layers, the ceramic core disposed between the third and the fourth ceramic layers, the third and the fourth ceramic layer including:
• b1) a plurality of via holes in the third and fourth ceramic layers;
• and
• b2) a plurality of high density circuit features on the third and fourth ceramic layers, and
• b3) the third and fourth ceramic layers attached to the ceramic core during a second firing, the third and fourth ceramic layers shrinking during the second firing so as to conserve mass in a direction perpendicular to the planar layers and from 0.8% to 1.2% in a direction parallel to the planar layers.