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US 6,205,028 B1Granted
Circuit substrate including printed circuit board having heat-shielding portion
AssigneeSharp Kabushiki Kaisha
InventorHiroshi Matsumura
Life of this patent
Estimating the term…
Abstract
A circuit substrate includes a plurality of electronic devices including a heat-generating electronic device, and a printed circuit board having the plurality of electronic devices mounted thereon and having a slit hole for thermally isolating a portion for mounting the heat-generating electronic device and a portion for mounting other electronic devices.
Claims13
A circuit device, comprising:
- a plurality of electronic devices including a heat-generating electronic device;
- and
- a printed circuit board having said plurality of electronic devices mounted thereon, wherein a plurality of unplated holes penetrating through said printed circuit board are provided at a periphery of said heat-generating electronic device thereby defining a heat-shield on said printed circuit board between a first portion where said heat-generating electronic device is mounted and a second portion where other of said electronic devices are mounted, and further wherein said heat-shield inhibits conduction of heat from said first portion to said second portion of said printed circuit board.
A circuit device, comprising:
- a plurality of electronic devices including a heat-generating electronic device;
- a printed circuit board having said plurality of electronic devices mounted thereon, wherein at least one unplated hole penetrating through said printed circuit board is provided at a periphery of a die of said heat-generating electronic device, thereby defining a heat-shield on said printed circuit board between a first portion where said heat-generating electronic device is mounted and a second portion where other of said electronic devices are mounted, and further wherein said heat-shield inhibits conduction of heat from said first portion to said second portion of said printed circuit board;
- a plurality of through holes in the second portion where said heat-generating electronic device is mounted;
- a heat radiation plate;
- a first die attaching pad provided at a top surface layer of said printed circuit board and in contact with said plurality of through holes and connected to said heat-generating electronic device;
- and
- a second die attaching pad provided at a bottom surface layer of said printed circuit board and in contact with said plurality of through holes, and connected to said heat radiation plate.
4 more elements
A circuit substrate comprising:
- a plurality of electronic devices including a heat-generating electronic device;
- a printed circuit board having said plurality of electronic devices mounted thereon and having a heat-shielding portion for thermally isolating a portion for mounting said heat-generation electronic device and a portion for mounting other electronic devices,
- a heat radiation plate;
- and
- an extension piece provided in said heat-shielding portion and in contact with said heat-shielding portion and said heat radiation plate.
2 more elements
Dependencies are inferred from the claim text.