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US 6,205,022 B1Granted
Apparatus for managing heat in a computer environment or the like
AssigneeIntel Corporation
InventorsRakesh Bhatia, Robert D. Padilla
Life of this patent
Estimating the term…
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AssigneeIntel Corporation
InventorsRakesh Bhatia, Robert D. Padilla
Estimating the term…
To manage heat in a computer environment or the like, a base plate and/or a input/output (I/O) plate includes an integrated heat pipe. For example, the base plate, located between a bottom surface of a laptop computer chassis and a printed circuit board (PCB) or motherboard would include a heat-pipe network that draws heat away from the heat generating components of the PCB (e.g., a processor) and distributes the heat over the base plate. The I/O plate may also serve the same purpose, located at an end of the PCB. The base plate heat pipe and I/O plate heat pipe are thermally coupled together or are of a unitary design so as to distribute the heat generated in the laptop computer over a larger area achieving a relatively low-temperature isothermal design.
An apparatus comprising:
An apparatus for managing heat comprising:
A laptop computer comprising:
Dependencies are inferred from the claim text.