Increased propagation speed across integrated circuits

A packaged integrated circuit comprising:

• an integrated circuit package having a cavity for propagating an electromagnetic wave of wavelength A;
• and
• an integrated circuit disposed in the cavity, the integrated circuit including:
• an antenna for receiving a signal induced by the electromagnetic wave;
• and
• a receiver circuit for amplifying the signal and providing an output signal,
• wherein the integrated circuit includes a plurality of antennas and a plurality of receiver circuits, wherein the cavity has a conductive planar inside surface, the integrated circuit having a substantially planar upper surface that extends parallel to the conductive planar inside surface of the cavity, and wherein the integrated circuit includes an upper layer of metal that is grounded, the upper layer of metal preventing electromagnetic energy from penetrating deeper into the integrated circuit, the upper layer of metal having a plurality of openings, wherein each antenna is disposed in a respective opening.

A packaged integrated circuit comprising:

• an integrated circuit package having a cavity for propagating an electromagnetic wave of wavelength A;
• and
• an integrated circuit disposed in the cavity, the integrated circuit including:
• an antenna for receiving a signal induced by the electromagnetic wave;
• and
• a receiver circuit for amplifying the signal and providing an output signal,
• wherein the integrated circuit includes a plurality of antennas and a plurality of receiver circuits, wherein the cavity has a conductive planar inside surface, the integrated circuit having a substantially planar upper surface that extends parallel to the conductive planar inside surface of the cavity, and wherein the integrated circuit includes an upper layer of metal, the upper layer of metal having a plurality of openings, each antenna receiving electromagnetic energy from the cavity through a respective opening.

A packaged integrated circuit comprising:

• an integrated circuit package having a cavity for propagating an electromagnetic wave of wavelength A;
• and
• an integrated circuit disposed in the cavity, the integrated circuit including:
• an antenna for receiving a signal induced by the electromagnetic wave, and a receiver circuit for amplifying the signal and providing an output signal,
• wherein the integrated circuit package further comprises:
• a conductive radiating surface from which the electromagnetic wave propagates into the cavity;
• an RF input terminal connected to the radiating surface;
• and
• a ground terminal connected to a ground plane of the integrated circuit.

A packaged integrated circuit comprising:

• an integrated circuit package having a cavity for propagating an electromagnetic wave of wavelength A;
• and
• an integrated circuit disposed in the cavity, the integrated circuit including:
• an antenna for receiving a signal induced by the electromagnetic wave;
• and
• a receiver circuit for amplifying the signal and providing an output signal,
• wherein the integrated circuit package is a ceramic package having a plurality of terminals and a metal cap, the metal cap sealing the integrated circuit in the cavity, the metal cap being connected to one of the terminals, an RF signal of wavelength A being present on the terminal.

A packaged integrated circuit comprising:

• an integrated circuit package having a cavity for propagating an electromagnetic wave of wavelength A;
• and
• an integrated circuit disposed in the cavity, the integrated circuit including:
• an antenna for receiving a signal induced by the electromagnetic wave, and a receiver circuit for amplifying the signal and providing an output signal,
• wherein the integrated circuit package further comprises:
• a coaxial cable connector having a center conductor;
• and
• a radiating conductor that forms an inside surface of the cavity, the radiating conductor being coupled to the center conductor of the coaxial cable connector for radiating the electromagnetic wave of wavelength A.

A packaged integrated circuit comprising:

• an integrated circuit package having a cavity for propagating an electromagnetic wave of wavelength A;
• and
• an integrated circuit disposed in the cavity, the integrated circuit including:
• an antenna for receiving a signal induced by the electromagnetic wave, and a receiver circuit for amplifying the signal and providing an output signal,
• wherein the integrated circuit package further comprises a coaxial cable connector having a center conductor, the center conductor extending into the cavity for radiating the electromagnetic wave of wavelength A.

A packaged integrated circuit, comprising:

• an integrated circuit package comprising a body, a cap, and a plurality of terminals, the integrated circuit package having a cavity, the cap comprising a conductive substantially planar layer, the conductive substantially planar layer being connected to one of the terminals;
• and
• an integrated circuit disposed in the cavity, the integrated circuit comprising a plurality of antennas disposed substantially in a plane, the integrated circuit also comprising a plurality of receiver circuits, the plane of the antennas being substantially parallel to the conductive substantially planar layer of the cap, each of the antennas being coupled to an input of a corresponding respective one of the receiver circuits, the plane of the antennas being separated from the conductive substantially planar layer of the cap by a distance of at least 1;
• 8 millimeters, each of the antennas having a length of at least 1.8 millimeters.