IC device contactor

An IC device contactor for electrically connecting a large number of spherical electrodes on one side of a substrate of an IC device positioned to undergo electrical testing to an IC tester, said IC device contactor comprising:

• a socket board having a predetermined number of contact points electrically connected to the IC tester;
• an anisotropic conductive sheet formed as a resilient insulating sheet having a multitude of fine conductive wires embedded therein, said fine conductive wires having a predetermined angular orientation across the thickness of said resilient insulating sheet with opposite ends of said fine conductive wires being exposed on opposite front and rear sides of said resilient insulating sheet;
• a predetermined number of contact tips made of conducting material, each contact tip having an abutting portion end configured to be placed in electrical contact with the ends of the fine conductive wires exposed on the rear side of the resilient insulating sheet and an opposite end provided with contacting petals configured to provide a resilient electrical connection to a spherical electrode of each IC device positioned to undergo testing;
• and
• a tip holder having an insulating plate perforated with a predetermined number of apertures to hold said contact tips detachably in position, said tip holder further being adapted to press the abutting portions of said contact tips into said electrical contact with the ends of the fine conductive wires exposed on the rear side of the resilient insulating sheet and to apply pressure through said resilient insulating sheet to establish resilient contact between the ends of the fine conductive wires exposed on the front side of the resilient insulating sheet and the contact points on said socket board,
• whereby said contact points on said socket board are electrically connected together with the spherical electrodes of each IC device positioned to undergo testing through the fine conductive wires of the resilient insulating sheet having the ends exposed on the front side thereof in resilient electrical contact with the contact points on the socket board and the ends exposed on the rear side thereof in resilient electrical contact with the abutting portions of the contact tips having contacting petals providing resilient electrical connection to each of said spherical electrodes of each said IC device positioned to undergo testing.