Resin encapsulated electrode structure of a semiconductor device, mounted semiconductor devices, and semiconductor wafer including multiple electrode structures
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorKohji Shinomiya
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Abstract
A semiconductor integrated circuit device includes a semiconductor substrate having a first surface and including electrodes on the first surface of the semiconductor substrate; a glass coating film covering the first surface of the semiconductor substrate except the electrodes; an external electrode on the electrode in electrical contact with the electrode and having a polished external surface; and a cured resin layer on the glass coating film forming a barrier against intrusion of moisture and ions into the semiconductor substrate, and having the same area as the semiconductor substrate, and a polished external surface.
Claims14
A semiconductor integrated circuit device comprising:
- a semiconductor substrate having a first surface and including an electrode on the first surface of the semiconductor substrate;
- a glass coating film covering the first surface of the semiconductor substrate except the electrode;
- an external electrode on the electrode, in electrical contact with the electrode, and having a substantially planar polished external surface;
- and
- a cured resin layer on the glass coating film, forming a barrier against intrusion of moisture and ions into the semiconductor substrate, the cured resin layer having the same area as the semiconductor substrate and a substantially planar polished external surface.
A mounting substrate comprising:
- a semiconductor substrate having a first surface and including an electrode on the first surface of the semiconductor substrate;
- a glass coating film covering the first surface of the semiconductor substrate except the electrode;
- an external electrode on the electrode, in electrical contact with the electrode, and having a substantially planar polished external surface;
- a cured resin layer on the glass coating film, forming a barrier against intrusion of moisture and ions into the semiconductor substrate, the cured resin layer having the same area as the semiconductor substrate and a substantially planar polished external surface;
- and
- a mounting substrate wherein the mounting substrate is soldered to the semiconductor substrate.
A semiconductor wafer comprising a plurality of semiconductor devices, each semiconductor device comprising:
- a semiconductor substrate having a first surface and including an electrode on the first surface of the semiconductor substrate;
- a glass coating film covering the first surface of the semiconductor substrate except the electrode;
- an external electrode on the electrode, in electrical contact with the electrode, and having a substantially planar polished external surface;
- and
- a cured resin layer on the glass coating film, forming a barrier against intrusion of moisture and ions into the semiconductor substrate, the cured resin layer having the same area as the semiconductor substrate and a substantially planar polished external surface.
Dependencies are inferred from the claim text.