Semiconductor device

A semiconductor device, comprising:

• a semiconductor chip having a main surface thereof, said semiconductor chip including a plurality of bump electrodes formed on the main surface;
• a thermal expansion/high elastic substrate having a first surface and a second surface opposite to the first surface, said substrate including a conductive pattern formed on the first surface, an insulating layer formed on the conductive pattern and the first surface of said substrate and a plurality of external electrodes formed on the second surface thereof, the insulating layer has an opening to expose the conductive pattern so that the conductive pattern is electrically connected to the bump electrodes, the external electrodes being electrically connected to the conductive pattern;
• and
• a high elastic liquid resin covering the main surface of said semiconductor chip, the first surface of said substrate and the bump electrodes,
• wherein said substrate has a Young modulus of about 8000 to 15000 kg/mm2.

A semiconductor device for mounting on an external substrate having a Young's modulus of about 3000 kg/mm2, comprising:

• a semiconductor chip having a main surface thereof, said semiconductor chip including a plurality of bump electrodes formed on the main surface;
• an internal substrate formed of material having a Young's modulus of about 8000 to 15000 kg/mm2, said internal substrate having a first surface and a second surface opposite to the first surface, said internal substrate including a conductive pattern electrically connected to the bump electrodes formed on the first surface and a plurality of external electrodes formed on the second surface thereof, the external electrodes being electrically connected to the conductive pattern and mounted on the external substrate;
• and
• a high elastic liquid resin covering the main surface of said semiconductor chip, the first surface of said internal substrate and the bump electrodes.