Semiconductor device

A semiconductor device comprising:

• a semiconductor chip having a main surface, said semiconductor chip including an integrated circuit and external terminals formed in said main surface, said main surface having a first pair of edges and a second pair of edges, said first pair of edges extending in a first direction, said second pair of edges extending in a second direction different than said first direction, said external terminals being arranged in said first direction;
• a first signal lead and a second signal lead, each having an inner lead and an outer lead which is continuous with said inner lead, said inner lead having a first portion and a second portion, each of the first portions being disposed over said main surface of the semiconductor chip and being spaced from each other in said first direction, each of the second portions of each of said first and second signal leads crossing one of said first pair of edges and extending out of said semiconductor chip, each of said first portions of said inner leads of said first and second signal leads being arranged between said external terminals and said one of said first pair of edges;
• a third signal lead and a fourth signal lead, each having an inner lead and an outer lead which is continuous with said inner lead, said inner lead of each of the third and fourth signal leads having a first portion and a second portion, each of the first portions of the third and fourth signal leads being disposed over said main surface of the semiconductor chip and being spaced from each other in said first direction, each of the second portions of said third and fourth signal leads crossing the other of said first pair of edges and extending out of said semiconductor chip, each of said first portions of said inner leads of said third and fourth signal leads being arranged between said external terminals and the other of said first pair of edges;
• a first insulating adhesive film being disposed between said main surface of said semiconductor chip and said first portions of said inner leads of said first and second signal leads;
• a second insulating adhesive film being disposed between said main surface of said semiconductor chip and said first portions of said inner leads of said third and fourth signal leads;
• bonding wires electrically connecting said external terminals of said semiconductor chip with said first portions of said inner leads of said first to fourth signal leads;
• and
• a sealing member sealing said semiconductor chip, said bonding wires, and said inner leads of said first to fourth signal leads, said outer leads of said first to fourth signal leads extending outwardly from said sealing member,
• wherein said main surface of said semiconductor chip and each of said first portions of said inner leads of said first and second signal leads are adhered to each other by said first insulating adhesive film,
• wherein said main surface of said semiconductor chip and each of said first portions of said inner leads of said third and fourth signal leads are adhered to each other by said second insulating adhesive film,
• wherein said first insulating adhesive film has a first part disposed under said first portion of said inner lead of said first signal lead, a second part disposed under said first portion of said inner lead of said second signal lead, and a third part between said first and second parts,
• wherein a width of said third part of said first insulating adhesive film, extending in the second direction, is narrower than that of each of said first and second parts of said first insulating adhesive film in said second direction,
• wherein said second insulating adhesive film has a first part disposed under said first portion of said inner lead of said third signal leads, a second part disposed under said first portion of said inner lead of said fourth signal lead, and a third part between said first and second parts, and
• wherein a width of said third part of said second insulating adhesive film, extending in the second direction, is narrower than that of each of said first and second parts of said second insulating adhesive film in said second direction.