Parts soldering apparatus and method
AssigneeNEC Corporation
InventorMitsuru Kurihara
Life of this patent
Estimating the term…
Abstract
To provide parts soldering apparatus and method which improve the productivity during parts soldering and increase the mounting accuracy of parts on a circuit board. The parts soldering apparatus of the present invention has: a stage for positioning a circuit board whereon, the circuit board is mounted a solder tip whereon; a loading arm made of a light-transmitting material, for loading a part onto the solder tip; a fluctuating mechanism for pressing the loading arm toward the circuit board; and an optical source for irradiating light onto the part through the loading arm and for melting the solder tip by the conductive heat of the light irradiated onto the part.
Claims6
A parts soldering apparatus comprising:
- a stage for positioning a circuit board thereon, a solder tip being mounted on said circuit board;
- a loading arm comprising a light-transmitting material, for loading a part onto said solder tip;
- a fluctuating mechanism for pressing said loading arm toward said circuit board;
- an optical source for irradiating light onto said part through said loading arm and for melting said solder tip by the conductive heat of said light irradiated onto said part;
- a fluctuating sensor for outputting a height detecting signal according to a height of said loading arm;
- and
- a controller for controlling an output power of said optical source in response to said height detecting signal from said fluctuating sensor.
A parts soldering method comprising:
- positioning a circuit board on a stage, said circuit board having a solder tip mounted thereon;
- loading a part onto said solder tip by a loading arm comprising a light-transmitting material;
- and
- irradiating light onto said part through said loading arm by pressing said part toward said circuit board by said loading arm and melting said solder tip by the conductive heat of said light irradiated onto said part,
- wherein said optical source is turned on at a first output power during a time when said loading arm moves from a height at a time of loading of said part onto said solder tip to a height at a time of melting of said solder tip,
- wherein said optical source is turned on at a second output power lower than said first output power during a time when said loading arm moves from the height at the time of melting of said solder tip to the height at a time said solder tip is solidified, and
- wherein said optical source is turned off after said loading arm has moved to the height of said solder tip being solidified.
Dependencies are inferred from the claim text.