Wiring board and process for the production thereof

A wiring board having a conductor layer formed on a substrate, a connecting pad disposed in a connecting pad disposition portion provided in part of the conductor layer surface and a coating layer formed on a surface around the connecting pad disposition portion of the conductor layer, a resin inflow prevention portion being provided on the coating layer adjacently to said connecting pad disposition portion of the conductor layer, the resin inflow prevention portion having a surface roughness greater than the surface roughness of said connecting pad disposition portion.

A process for the production of a wiring board having a conductor layer formed on a substrate and a connecting pad formed of a plating layer on part of said conductor layer, the process comprising:

• a pad formation step of selecting a metal which can work as an etching resist when said conductor layer is chemically surface-roughened, and metal-plating part of an upper surface of said conductor layer to form at least an uppermost portion of said connecting pad with the selected metal, and
• a chemical surface-roughening step of chemically roughening an upper surface of said conductor layer located around said connecting pad and not plated with said connecting pad, using said connecting pad as an etching resist, to form on said upper surface of said non-plated conductor layer around said connecting pad a greater roughness than the upper surface roughness of said conductor layer plated with said connecting pad.

A process for the production of a wiring board having a conductor layer formed on a substrate, a connecting pad formed of a plating layer on part of said conductor layer and a coating layer formed around said connecting pad on said conductor layer, the process comprising

• a pad formation step of selecting a metal which is not surface-roughened by chemical surface-roughening when said coating layer is chemically surface-roughened, and metal-plating part of an upper surface of said conductor layer to form at least an uppermost portion of said connecting pad with the selected metal, and
• a chemical surface-roughening step of chemically roughening an upper surface of said coating layer such that an upper surface of said coating layer has a greater roughness than an upper surface of said conductor layer plated with said connecting pad.