Low dielectric constant porous films
AssigneeAlliedSignal Inc.
InventorsRoger Yu-Kwan Leung, Suzanne Case
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Abstract
The present invention relates to novel low dielectric constant nanoporous dielectric films having improved mechanical strength, and to improved processes for producing the same on substrates suitable for use in the production of integrated circuits. The nanoporous dielectric films are prepared by a process of preparing a mixture of a spin-on-glass material with a suitable thermally degradable polymer that is soluble in polar solvents. The resulting mixture is then applied onto a substrate suitable for use in the production of an integrated circuit, to produce a coated substrate that is heated for a time and at one or more temperatures effective to degrade the polymer, so as to produce the desired low dielectric nanoporous dielectric film.
Claims28
A low dielectric nanoporous film comprising a spin-on glass base material, said film produced by a process comprising the steps of
- (a) preparing a mixture of at least one spin-on-glass material with a thermally degradable polymer soluble in a polar solvent,
- (b) applying the mixture of step (a) onto a substrate to produce a coated substrate,
- (c) heating the coated substrate of step (b) for a time and at one or more temperatures effective to produce the desired low dielectric nanoporous film.
A method of producing a low dielectric nanoporous film on a substrate comprising the steps of,
- (a) preparing a mixture of a suitable spin-on-glass material with a thermally degradable polymer soluble in a polar solvent,
- (b) applying the mixture of step (a) onto a substrate, to produce a coated substrate,
- (c) heating the coated substrate of step (b) for a time and at one or more temperatures effective to produce the desired low dielectric nanoporous film on said substrate.
Dependencies are inferred from the claim text.