Finishing method for semiconductor wafers using a lubricating boundary layer
AssigneeBeaver Creek Concepts Inc
InventorCharles J Molnar
Life of this patent
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Abstract
A method of using lubricating boundary layers for finishing semiconductor wafers is described. The lubricating boundary layer thickness is controlled to improve finishing and reduce unwanted surface defects. Differential lubricating boundary layer methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing.
Claims20
A method of finishing of a semiconductor wafer surface being finished comprising the steps of:
- providing a finishing element finishing surface;
- providing an organic lubricant to an operative finishing interface;
- and
- applying an operative finishing motion in the operative finishing interface forming an organic lubricating boundary layer of from 1 to 6 molecules thick.
A method of finishing of a heterogeneous semiconductor wafer surface being finished comprising the steps of:
- providing a finishing element finishing surface;
- providing an organic lubricant proximate to an operative finishing interface comprising the interface between the heterogeneous semiconductor wafer surface being finished and finishing element finishing surface;
- and
- applying an operative finishing motion in the operative finishing interface forming plurality of lubricating boundary layers of from 1 to 10 molecules thick in the operative finishing interface.
A method of finishing of a heterogeneous semiconductor wafer surface being finished comprising the steps of:
- providing a finishing element finishing surface;
- providing an organic lubricant proximate to an operative finishing interface comprising the interface between the heterogeneous semiconductor wafer surface being finished and finishing element finishing surface;
- and
- applying an operative finishing motion to the operative finishing interface forming a differential organic lubricating boundary layer in the operative finishing interface;
- and
- controlling the lubricating boundary layer film physical form by changing the lubrication control parameters in situ based on feed back information from a lubrication control subsystem having an energy change sensor.
Dependencies are inferred from the claim text.