Integrated circuit package for flip chip with alignment preform feature and method of forming same

A method of forming an integrated circuit package comprising the steps of:

• forming a substrate having a circuitry pattern thereon;
• positioning a thermoplastic attachment film on the substrate, wherein the thermoplastic attachment film includes vias that expose the circuitry pattern;
• mounting a flip chip on the thermoplastic attachment film, wherein the flip chip includes input/output contacts formed as thermoplastic conductive bumps that are received within the vias of the thermoplastic attachment film to engage the circuitry pattern;
• heating the substrate, thermoplastic attachment film and the flip chip together to a temperature sufficient to form a thermoplastic bond between the substrate, thermoplastic attachment film and the thermoplastic conductive bumps of the flip chips;
• applying heat to soften the thermoplastic attachment film and the thermoplastic conductive bumps such that both the thermoplastic attachment film and thermoplastic conductive bumps become pliable;
• and
• and removing the flip chip.